Argus Systems (AESPL) is leading Electronic design Services and PCB fabricator providing high quality multi-layered Rigid PCB,Flexible PCB,Flexi Rigid PCB,HDI PCB & RF PCB solutions for Aerospace & Defense (AS9100D,MIL-PRF,LCSO),Medical (ISO 13485),Automotive (IATF 16949 )and industrial applications.
Flexible and Rigid Flex PCB circuitry provides a means to integrate multiple PCB assemblies without wires, cables or connectors, replacing them with thin, light composites that integrate wiring in ultra-thin, flexible ribbons between sections. In flex Rigid PCB packaging, a flexible circuit substrate provides a backbone of wiring with rigid multi-layer circuit sections built up as modules where needed. advantages for Flexible PCB & flex Rigid PCB includes Improved Resistance to vibrations and movement, Small package size, High tensile strength, High bendiness-up to 360 degrees and suitability for harsh environments.
High Density Interconnect PCB Design use latest PCB manufacturing technologies available to increase the functionality of PCBs using the same or less amount of area.HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high-performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections.
A microvia maintains a laser drilled diameter of (typically 0.006" (150μm), 0.005" (125μm), or 0.004" (100μm),which are optically aligned and require a pad diameter (typically 0.012" (300μm), 0.010" (250μm), or 0.008"(200μm), allowing additional routing density. Microvias can be via-in-pad, offset, staggered or stacked, non conductive filled and copper plated over the top or solid copper filled or plated.
Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below. Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used, however, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device, requires the use of Stacked MicroVias using an inverted pyramid routing technique
RF PCB Fabricator with advanced engineering and process capabilities with wide range of low loss laminates and resin systems supporting a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W) for aerospace & Defense electronics, medical devices, Automotive ADAS and telecommunications equipment’s.
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Argus Systems (AESPL) a globally recognized PCB Design and PCB fabrication company supporting Fabrication of Flexible PCB, Rigid Flex PCB, HDI PCB and RF PCB for Its Global Clients in India, USA, UK and Australia as per Automotive ( IATF 16949 ), Medical Devices (ISO 13485), Aerospace & Defense (AS9100D, MIL-PRF, LCSO) quality management standards.