Rigid Flex HDI PCB , Flexible PCB (FPC)

Flex PCB and Rigid Flex HDI PCB

Flex PCB and Rigid-Flex PCB

• Multilayer flexible material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
• Multilayer rigid and flexible material combinations (more than two conductor layers) with plated through holes and HDI.
• 1-20 layers flex Rigid PCB
• Rigid-Flex PCB with Dimensions up to 24" x 48".
• Thickness up 0.125".
• 4/4 mil line width/spacing.
• FR4 material for Rigid core & Prepreg.
• Acrylic, epoxy, and adhesiveless polyimide flex materials.
• Dupont Material for Flex core, Coverlay film and flex adhesive.
• Bikini cut, bookbinder, loose-leaf construction.

High Density Interconnect PCB

• High Density Interconnect PCB Design use latest PCB manufacturing technologies available to increase the functionality of PCBs using the same or less amount of area.
• HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area.
• 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
• i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high-density interconnection layers.
• Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via").
• 2/2 mil line/space with 4/8 mil laser via capture pad size.
• Material options:High temperature FR4, Halogen – Free and High Speed (low loss).

HDI PCB Microvias

• A microvia maintains a laser drilled diameter of (typically 0.006" , 0.005" , or 0.004" ),which is optically aligned and requires a pad diameter (typically 0.012" , 0.010" , or 0.008"), allowing additional routing density.
• Microvias can be via-in-pad, offset, staggered or stacked, non conductive filled and copper plated over the top or solid copper filled or plated.
• Microvias on different layers can be staggered or stacked.
• Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below.
• Standard Microvias limited to layers 1-2 & 1-3.
• Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used.
• Routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch devices, requires the use of Stacked MicroVias using an inverted pyramid routing technique.

HDI PCB Stacked MicroVias

• Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections.
• Stacked MicroVias Allows increased routing on multiple layers as Standard Microvias limited to layers 1-2 & 1-3.
• Stacked MicroVias Provides routing solutions for next generation small pitch packages of 0.5/0.4/0.3/0.25 mm.
• Stacked MicroVias Provide solid copper plate eliminating potential solder voiding.

HDI PCB Deep Microvias & Deep Stacked MicroVias

• Deep Microvias & Deep Stacked MicroVias have Improved Impedance performance.
• Provide additional dielectric material.
• Maintains small geometries on multiple layers.
• Improved signal integrity.
• Provides RF Microvia solutions.
• Provides a solid copper plate.
• Improves Current Carrying Capability & Thermal Management.
• Provides a Planar surface for BGA (Via-in-Pad).

Rigid , Flex RF & Microwave PCB

• Selective plated up layers.
• Exact registration/laser direct imaging.
• Front to back registration of etched cores.
• Mixed Dielectric constructions.
• Buried / Blind / Microvia.
• Multilevel cavity constructions.
• Optical mill / drill, Laser routing.
• Back Drill for Precision Stub Removal.
• Sequential lamination.
• Plated edges.
• Hole Fill (Conductive, nonconductive, and partial hole fill options).
• Surface Finishes (ENIG, ENEPIG, Hard and soft wire bondable gold, Immersion silver).

RF & Microwave PCB

• Microwave & RF PCB manufacturer with advanced engineering and process capabilities.
• Wide range of low loss laminates and resin systems.
• Supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W) for aerospace & Defense electronics, medical devices, Automotive ADAS, networking and telecommunications equipment.
• High Power RF PCB Thermal Solutions include Copper coins and slugs, Metal Core & Metal Back, and Thermally conductive laminates.