Electronic System and PCB design, analysis and consulting

Signal Integrity Analysis, Power Integrity Analysis, Thermal Analysis, Reliability Analysis, EMI EMC Analysis, DFM Analysis, DFA Analysis, DFT Analysis

Signal Integrity, Power Integrity, Thermal, EMI, EMC, Reliability, DFM, DFA, DFT

Argus is one of the leading PCB and system level design and analysis Services Company offering System and PCB level Signal Integrity Analysis ( Si analysis), PCB Thermal Analysis, Power Integrity Analysis ( PI Analysis), Crosstalk analysis, EMI EMC Analysis, Reliability availability and maintainability analysis as well PCB design and PCB layout design for applications like Space, Avionics, Telecom, Industrial, Medical, Computing, and Automotive.
A growing number of companies are experiencing a sharp upturn in PCB and system level Signal Integrity, Power Integrity, Thermal, EMI EMC and Reliability issues that result in project delays and increased cost. Many companies do not have in-house expertise and the companies that do have the expertise may experience peak overloads that require periodic outsourcing. Argus quick turn systm level and pcb design analysis services address the needs of these customers by providing expert resources at very affordable prices.



PCB Power Integrity Analysis services,SI analysis,SI Analysis in India,SI analysis In USA,SI analysis In UK,Signal Integrity Analysis,
		   							signal integrity analysis service,signal integrity analysis service in india,pcb thermal analysis,pcb thermal analysis services,PCB thermal analysis services In India,
  		   							Thermal Analysis,Thermal Analysis Services,Si and PCb Thermal Analysis,Electronics and PCB Thermal Analysis,Power Integrity Analysis,Power Integrity Analysis Services,
  		   							Power Integrity Analysis and Signal Integrity Analysis,Power Integrity Analysis Services in India,Top power integrity analysis service provider in india,
		  							Best power integrity analysis service in india

Signal Integrity Analysis

  • System and PCB signal integrity analysis
  • Multi Board signal integrity analysis

  • Pre-Route and post-route PCB Si Analysis

    • Reflection Waveform Analysis
    • Crosstalk Analysis
    • Propagation delay and timing analysis
    • Eye Diagram Analysis

    • Library and model Development

    • IBIS Model Creation
    • IBIS Model validation

    Pre Layout PCB SI Analysis Check

    • Placement optimization, Trace length constraints
    • Impedance requirement.
    • Topology and termination strategies.

    Post Layout PCB SI analysis check

    • Verification by extraction of actual PWD parasitic.
    • Placement optimization based on signal flow & trace length requirement of the specific interface.
    • Layer stack-up recommendation.
    • Reflections analysis and determination of termination scheme.
    • Generation of PCB layout constraints & guidelines.
    • Delay & Timing determination.
    • Crosstalk level estimation.
    • Eye diagram analysis.
    Power Integrity Analysis

    Power Integrity Analysis

    • Power Integrity can identify the potential problems and with appropriate modifications, validations it can identify problem on virtual prototypes.

    DC Drop Analysis

    • Modeling Power Plane structures to validate IR/DC drop in power supply
    • rails due to copper losses.
    • Output available in the form of a report indicating current flow and voltage at each power pins of circuit devices.
    • 3D Plots generation representing voltage distribution through the power planes.
    • Current density 3D plot.

    Decoupling Analysis

    • Analyzing the impedance of the power distribution network at multiple board locations and suggesting proper decoupling schemes.
    • PCB layout Stack up suggestions for proper board decoupling.
    • Frequency versus Impedance plot.

    DC Noise Analysis

    • Simulation of plane noise due to improper decoupling schemes.
    • A 3D plot of plane noise.
    Thermal Analysis

    System, PCBA, PCB Thermal analysis

    • System and PCB Thermal Analysis, simulation, and Design.
    • PCB data import through IDF files available from all EDA tools.
    • Component Junction and case temperature computations.
    • PCB Thermal profiles generation for components and PCB.
    • Reports consist of board temperature and gradients, excess temperature, 3D airflow, and temperature distribution.
    • Simulation of Metal Core Designs and verification of the cooling effects and application design modifications.
    • Detection of hot spots and correction with heat transfer mechanisms analysis viz., Conduction, Convection, Radiation.
    • Support on Heat Sink Design and cooling proposals.
    • System and PCB Thermal analysis of applications like Defense, Avionics, Telecom, Medical, Computer, Automotive, and Power supplies.
    Reliability Analysis

    Electronics Hardware reliability analysis

    • System and PCB Reliability Analysis.
    • System availability analysis.
    • System maintainability analysis.
    • System and PCBA Failure mode, effects, and criticality analysis (FMECA )as per MIL-STD-1629A.
    • Uses Reliability diagram, Fault tree analysis, and applicable standard models.
    • Failure rates and MTBF Analysis based on MIL-217 models.
    • Reliability prediction as per Telcordia/ Bell core (TR-332/SR-332) models.
    • Reliability Prediction as per IEC62380 models.
    • Reliability Analysis consists of MTBF calculation for all components present in the card.
    • MTBF vs Temperature range graph.
    • Derating analysis.
    • Reliability Reports with details of Failure rate by part type and Failure rate parts list.
    • System and PCB Reliability Analysis for Defence and Aerospace Applications includes Airborne, Commercial, Naval, Missile, Ground Fixed and Ground Mobile.
    EMI Analysis

    EMI EMC simulation & analysis

    • Printed circuit board Level and System level analysis.
    • Radiated Emissions Analysis.
    • Near Filed, Far Filed Emissions
    • Net and Board level radiated emissions
    • validation as per Compliance template of FCC, CISPR, VCCI, User
    • Support and guidelines for selecting the appropriate filters for various applications.
    • EMC Control Planning.
    • EMI Test Plans and Procedures Development.
    • EMI EMC Product design review.
    • EMC Performance Requirements Definition.
    • Design mitigation.
    • Gap Analysis & Risk Mitigation Plans.
    • Compliance risk assessments.
    • Flow Down Requirements.
    RF Simulation

    RF Simulation & Analysis

      RF Simulation Process considers below aspects of PCB Design & PCB layout design:
    • Material Selection
    • Control of Impedance
    • Trace Design
    • Earth Plane, Ground Plane
    • Shielding
    • Via Management
    • Component Placement
    • Power Supply Decoupling
    • RF Circuit Simulation
    • Electronic (EM) Simulation
    • RF System Simulation
    • RF Antenna optimisation
    • RF system Thermal Simulation
    • RF system mechanical Simulation
    DFM, DFA, DFT Analysis

    DFX ( DFM, DFA, DFT) analysis

    • Design for manufacturing (DFM) analysis.
    • Design for assembly (DFA) analysis and evaluation.
    • Design for Test (DFT) analysis as per specific test fixture requirements.
    • Verification of inputs files for CAM Compatibility, generating reports on individual board characteristics against manufacturing spec.
    • Verification of opens and shorts, Matching of drill data for accuracy.
    • Layer Analysis for annular ring, space & trace widths, solder Mask, fiduciary openings & exposed traces.
    • Silkscreen removal, scoring, V-cuts, routing, slot, route and retain, test coupons
    Manufacturing Feasibility Study

    Manufacturing Feasibility analysis, CAM

    • Manufacturer’s requirement for volume manufacturing is very important aspects that need to be identified before design & building the prototypes.
    • Using sketch data of PCB, PCA analyze product potential for manufacturing success.
    • Manufacturing SWOT Analysis
    • NPI & PPAP Process Mapping
    • Compliance & Legal Assistance
    • Cost/Profit /Risk Analysis
    • First article inspection services ( FAI ) to ensure that produced parts are in accordance with the design data, the specification and customer expectations.
    Electronic System Design and Manufacturing Analysis

    Signal Integrity analysis, Power Integrity Analysis (PI analysis), Thermal Analysis, EMI EMC Analysis, Reliability Analysis, DFx Analysis

    Argus Systems a globally recognized Electronic Hardware Design and electronic manufacturing company Providing hardware system design, Electronics Hardware design, PCB layout design and electronis product design analysis (PCB Signal Integrity analysis, PCB Power Integrity analysis( PI analysis), PCB crosstalk analysis, Derating analysis, PCB Thermal analysis, PCB Reliability analysis, PCB EMI EMC analysis, derating analysis PCB DFM analysis, PCB DFA analysis, PCB DFT analysis) to Its Global Clients in India, USA, UK for Automotive, Medical, Aerospace & Defense and Industrial applications.