System & PCB Design Analysis

Power Integrity Analysis, Thermal Analysis, EMI EMC Analysis

Power Integrity Analysis, Thermal Analysis, EMI EMC Analysis

PCB Power Integrity is not a new term in high-speed digital design and analysis. Ever increasing count of PCB layout planes, form factor limitation, high IC density, cost constraint are few of many factors which results in complex electronic designs.

Power integrity Analysis ( PI Analysis ) is sometimes assumed as a sub discipline of Signal Integrity, but as they are coherently related they have distinctive features of their own which are to be done in different ways. Signal Integrity analysis is based on transmission lines whereas in Power Integrity analysis we are dealing with power distribution through transmission planes.

PCB Power Integrity Analysis ( PI Analysis) can identify the potential problems and with appropriate modifications and validations the analysis can be done again, this trial and error approach helps to identify problem on virtual prototypes and saves in turn cost of actual manufacturing and later re-spin of boards.

Power Integrity Analyis Types

Each of these phase requires expensive tools and capital equipment expenditures which can be lowered significantly if these can be outsourced to the external custom electronic design team that has the required tools and experience. This will in turn reduce the operational cost of the start-up business and help them to focus on their strategy and lean them to profitability.

Argus Systems is leader in PCB and system-level design and analysis Services offering Power Integrity Analysis (PI Analysis), Signal Integrity Analysis (SI analysis), Thermal Analysis, EMI Analysis, EMC Analysis Reliability, availability, and maintainability analysis, for applications like Defence, Space, Avionics, Networking, Telecom, Industrial, Medical, Semiconductor, Robotics, Computing and Automotive.

Electronic Systems and PCB Thermal Simulation and Thermal Analysis

For System Level and PCB Thermal Analysis Gather inputs from customer / datasheets such as ambient conditions, power dissipation, board details (number of layers, thermal vias etc), device part numbers/ datasheets, material specification etc.

Processing IDF files – board layout and devices are modelled by importing and cleaning the IDF files.

Modelling chassis / enclosures / covers

If 3D CAD is available, the data is converted into formats/shapes that are usable in the analysis tool. Else, the model is constructed based on the specifications.

Meshing – number of cells and the sizing is decided based on the thermal /flow requirements.

Mesh independency checks are carried out to arrive optimum mesh density.

Application of boundary conditions and numerical simulation of the model.

Selection of boundary conditions and numerical models Simulation results are verified by appropriate hand calculations.

Result review, documentation and recommendation of design improvements Results are thoroughly analysed to understand thermal bottlenecks, flow distribution etc.

Contour / vector plots, quantitative data (temperature, flow rate etc) are documented. Design improvements are suggested based on these observations. Based on customer comments, the design changes implemented, and optimization is carried out till the specifications are met.

Electronic Systems and PCB EMI EMC Simulation and EMI EMC Analysis

All electronic products which are intended for commercial, residential, industrial or military use must pass EMC (Electromagnetic compatibility) and electromagnetic interference (EMI) standards tests. They must perform their intended function in the electromagnetic environment and also must not degrade the performance of other devices.

These standards are country specific and are governed by local organizations. The EMI testing on electronic equipment for the United States is handled by the Federal Communications Commission (FCC) and is commonly referred as Part 15 testing. The EMI testing for Canada is presented in the Industry Canada ICES-003 standard. In Japan the EMI testing standard is outlined by VCCI. Majority of worldwide standards are derived from Comite International Special des Perturbations Radio electriques (CISPR) standards or International Electrotechnical Commission (IEC) EMC/EMI/ESD standards.

EMI and EMC Simulation and Analysis at Product Design phase tests are often performed late in the product development cycle, generally at the system level using expensive anechoic chamber. This approach leads to lengthy development cycle and turns out to be very expensive if violations are discovered at this stage. It is recommended to opt for design analysis services if your product is time or mission critical. Many optimizations can be done at PCB design phase and layout can be modified with minimal cost and effort.Using design, analysis and verification techniques early in design cycle is recommended as it helps in eliminating many layout iterations.

Analysis of radiated emission, far and near field emission , EMC emission can be done. SI and crosstalk issues can be resolved at this stage These analyses provide insights that helps in successful regulation compliance testing and thus avoid costly hardware re-spins and reduce time-to-market.

System Level and PCB Level Design Simulation and Analysis

Contact AESPL to discuss your PCB Power Integrity Analysis, PCB Thermal Simulation, PCB Thermal Analysis and PCB EMI EMC Analysis, EMI EMC simulation requirements.

Argus Systems a globally recognized PCB Design and electronic manufacturing company Providing hardware system design, Electronics Hardware design, PCB layout design and product design analysis (PCB Signal Integrity Analysis , PCB Power Integrity Analysis ( PI Analysis) , PCB Thermal Simulation, PCB Thermal Analysis, Reliability Analysis , PCB EMI EMC Simulation ,PCB EMI EMC analysis , PCB Crosstalk Analysis) to Its Global Clients in India , USA, UK, and Australia for Automotive, Medical, Aerospace & Defence and Industrial applications.