Product engineering & Analysis

SI Analysis

Pre-Route and post-route Si Analysis

• Reflection Waveform Analysis
• Cross Talk Analysis
• Propagation delay and timing analysis
• Eye Diagram Analysis

Library and model Development

• IBIS Model Creation
• IBIS Model validation

Pre Layout Signal Integrity Check

• Placement optimization, Trace length constraints
• Impedance requirement.
• Topology and termination strategies.

Post Layout Signal Integrity check

• Verification by extraction of actual PWD parasitic.
• Placement optimization based on signal flow & trace length requirement of the specific interface.
• Layer stack-up recommendation.
• Reflections analysis and determination of termination scheme.
• Generation of layout constraints & guidelines.
• Delay & Timing determination.
• Crosstalk level estimation.
• Eye diagram analysis.

Power Integrity Analysis

DC Drop Analysis

• Modeling Power Plane structures to validate IR/DC drop in power supply
• rails due to copper losses.
• Output available in the form of a report indicating current flow and voltage at each power pins of circuit devices.
• 3D Plots generation representing voltage distribution through the power planes.
• Current density 3D plot.

Decoupling Analysis

• Analyzing the impedance of the power distribution network at multiple board locations and suggesting proper decoupling schemes.
• Stack up suggestions for proper board decoupling.
• Frequency versus Impedance plot.

DC Noise Analysis

• Simulation of plane noise due to improper decoupling schemes.
• A 3D plot of plane noise.

Thermal Analysis

• System-Level and PCB Thermal Analysis, simulation, and Design.
• PCB data import through IDF files available from all EDA tools.
• Component Junction and case temperature computations.
• PCB Thermal profiles generation for components and PCB.
• Reports consist of board temperature and gradients, excess temperature, 3D airflow, and temperature distribution.
• Simulation of Metal Core Designs and verification of the cooling effects and application design modifications.
• Detection of hot spots and correction with heat transfer mechanisms analysis viz., Conduction, Convection, Radiation.
• Support on Heat Sink Design and cooling proposals.
• System and PCB Thermal analysis of applications like Defense, Avionics, Telecom, Industrial, Medical, Computer, Instrumentation, Automotive, and Power supplies.

Reliability Analysis

• System Reliability Analysis.
• System availability analysis.
• System maintainability analysis.
• Failure mode, effects, and criticality analysis (FMECA )as per MIL-STD-1629A.
• Uses Reliability diagram, Fault tree analysis, and applicable standard models.
• Failure rates and MTBF Analysis based on MIL-217 models.
• Reliability prediction as per Telcordia/ Bell core (TR-332/SR-332) models.
• Reliability Prediction as per IEC62380 models.

EMI EMC Analysis

• Board Level and System-level analysis.
• Radiated Emissions Analysis.
• Near Filed, Far Filed Emissions
• Net and Board level radiated emissions
• validation as per Compliance template of FCC, CISPR, VCCI, User

DFX & CAM Analysis

• Design for manufacturing/Analysis (DFM) analysis and evaluation
• Design for Test (DFT) analysis as per specific test fixture requirements.
• Verification of inputs files for CAM Compatibility and generating reports on individual board characteristics against manufacturing specifications.
• Verification of opens and shorts, Matching of drill data for accuracy.
• Layer Analysis for annular ring, space & trace widths, solder Mask, fiduciary openings & exposed traces.
• Silkscreen removal, scoring, V-cuts, routing, slot, route and retain, test coupons
• Gerber Translation/Reconstruction, Gerber-DFX,DXF editing & conversion
• Penalization or board array configuration with maximum usages.