SI Analysis

Pre-Route and post-route Si Analysis

Library and model Development

Pre Layout Signal Integrity Check

Post Layout Signal Integrity check

Verification by extraction of actual PWD parasitic.
Placement optimization based on signal flow & trace length requirement of the specific interface.
Layer stack-up recommendation.
Reflections analysis and determination of termination scheme.
Generation of layout constraints & guidelines.
Delay & Timing determination.
Crosstalk level estimation.
Eye diagram analysis.

DC Drop Analysis

Modeling Power Plane structures to validate IR/DC drop in power supply
rails due to copper losses.
Output available in the form of a report indicating current flow and voltage at each power pins of circuit devices.
3D Plots generation representing voltage distribution through the power planes.
Current density 3D plot.

Decoupling Analysis

Analyzing the impedance of the power distribution network at multiple board locations and suggesting proper decoupling schemes.
Stack up suggestions for proper board decoupling.
Frequency versus Impedance plot.

DC Noise Analysis

System-Level and PCB Thermal Analysis, simulation, and Design.
PCB data import through IDF files available from all EDA tools.
Component Junction and case temperature computations.
PCB Thermal profiles generation for components and PCB.
Reports consist of board temperature and gradients, excess temperature, 3D airflow, and temperature distribution.
Simulation of Metal Core Designs and verification of the cooling effects and application design modifications.
Detection of hot spots and correction with heat transfer mechanisms analysis viz., Conduction, Convection, Radiation.
Support on Heat Sink Design and cooling proposals.
System and PCB Thermal analysis of applications like Defense, Avionics, Telecom, Industrial, Medical, Computer, Instrumentation, Automotive, and Power supplies.

System Reliability Analysis.
System availability analysis.
System maintainability analysis.
Failure mode, effects, and criticality analysis (FMECA )as per MIL-STD-1629A.
Uses Reliability diagram, Fault tree analysis, and applicable standard models.
Failure rates and MTBF Analysis based on MIL-217 models.
Reliability prediction as per Telcordia/ Bell core (TR-332/SR-332) models.
Reliability Prediction as per IEC62380 models.
Reliability Analysis consists of MTBF calculation for all components present in the card.
MTBF vs Temperature range graph.
Reliability Reports with details of Failure rate by part type and Failure rate parts list.
Operating Environment covers Airborne, Commercial, , Naval, Missile , Ground Fixed and Ground Mobile Application.

Board Level and System-level analysis.
Radiated Emissions Analysis.
Near Filed, Far Filed Emissions
Net and Board level radiated emissions
validation as per Compliance template of FCC, CISPR, VCCI, User
Support and guidelines for selecting the appropriate filters for various applications.
EMC Control Planning.
EMI Test Plans and Procedures Development.
EMI/EMC Product design review.
EMC Performance Requirements Definition.
Design mitigation.
Gap Analysis & Risk Mitigation Plans.

Design for manufacturing/Analysis (DFM) analysis and evaluation
Design for Test (DFT) analysis as per specific test fixture requirements.
Verification of inputs files for CAM Compatibility and generating reports on individual board characteristics against manufacturing specifications.
Verification of opens and shorts, Matching of drill data for accuracy.
Layer Analysis for annular ring, space & trace widths, solder Mask, fiduciary openings & exposed traces.
Silkscreen removal, scoring, V-cuts, routing, slot, route and retain, test coupons
Gerber Translation/Reconstruction, Gerber-DFX,DXF editing & conversion
Penalization or board array configuration with maximum usages.

Design Analysis