Product Design Analysis: SI, PI, Thermal, EMI/EMC, Reliablity
Argus is one of the leading PCB and system-level design and analysis Services Company offering Signal Integrity Analysis,PCB Thermal Analysis, Power Integrity Analysis, Crosstalk analysis, EMI EMC Analysis, Reliability availability and maintainability analysis for applications like Space, Avionics, Telecom, Industrial, Medical, Computing, and Automotive.
A growing number of companies are experiencing a sharp upturn in system-level Signal Integrity, Thermal, and Reliability issues that result in project delays and increased cost.
Many companies do not have in-house expertise and the companies that do have the expertise may experience peak overloads that require periodic outsourcing. Argus quick turn design analysis services address the needs of these customers by providing expert resources at very affordable prices.
SI Analysis
Pre-Route and post-route Si Analysis
- Reflection Waveform Analysis
- Cross Talk Analysis
- Propagation delay and timing analysis
- Eye Diagram Analysis
- IBIS Model Creation
- IBIS Model validation
Library and model Development
Pre Layout Signal Integrity Check
- Placement optimization, Trace length constraints
- Impedance requirement.
- Topology and termination strategies.
Post Layout Signal Integrity check
- Verification by extraction of actual PWD parasitic.
- Placement optimization based on signal flow & trace length requirement of the specific interface.
- Layer stack-up recommendation.
- Reflections analysis and determination of termination scheme.
- Generation of layout constraints & guidelines.
- Delay & Timing determination.
- Crosstalk level estimation.
- Eye diagram analysis.
Power Integrity Analysis
- Power Integrity can identify the potential problems and with appropriate modifications, validations it can identify problem on virtual prototypes.
DC Drop Analysis
- Modeling Power Plane structures to validate IR/DC drop in power supply
- rails due to copper losses.
- Output available in the form of a report indicating current flow and voltage at each power pins of circuit devices.
- 3D Plots generation representing voltage distribution through the power planes.
- Current density 3D plot.
Decoupling Analysis
- Analyzing the impedance of the power distribution network at multiple board locations and suggesting proper decoupling schemes.
- Stack up suggestions for proper board decoupling.
- Frequency versus Impedance plot.
DC Noise Analysis
- Simulation of plane noise due to improper decoupling schemes.
- A 3D plot of plane noise.
Thermal Analysis
- System and PCB Thermal Analysis, simulation, and Design.
- PCB data import through IDF files available from all EDA tools.
- Component Junction and case temperature computations.
- PCB Thermal profiles generation for components and PCB.
- Reports consist of board temperature and gradients, excess temperature, 3D airflow, and temperature distribution.
- Simulation of Metal Core Designs and verification of the cooling effects and application design modifications.
- Detection of hot spots and correction with heat transfer mechanisms analysis viz., Conduction, Convection, Radiation.
- Support on Heat Sink Design and cooling proposals.
- System and PCB Thermal analysis of applications like Defense, Avionics, Telecom, Medical, Computer, Automotive, and Power supplies.
Reliability Analysis
- System and PCB Reliability Analysis.
- System availability analysis.
- System maintainability analysis.
- System and PCBA Failure mode, effects, and criticality analysis (FMECA )as per MIL-STD-1629A.
- Uses Reliability diagram, Fault tree analysis, and applicable standard models.
- Failure rates and MTBF Analysis based on MIL-217 models.
- Reliability prediction as per Telcordia/ Bell core (TR-332/SR-332) models.
- Reliability Prediction as per IEC62380 models.
- Reliability Analysis consists of MTBF calculation for all components present in the card.
- MTBF vs Temperature range graph.
- Reliability Reports with details of Failure rate by part type and Failure rate parts list.
- System and PCB Reliability Analysis for Defence and Aerospace Applications includes Airborne, Commercial, Naval, Missile, Ground Fixed and Ground Mobile.
EMI EMC Analysis
- Board Level and System-level analysis.
- Radiated Emissions Analysis.
- Near Filed, Far Filed Emissions
- Net and Board level radiated emissions
- validation as per Compliance template of FCC, CISPR, VCCI, User
- Support and guidelines for selecting the appropriate filters for various applications.
- EMC Control Planning.
- EMI Test Plans and Procedures Development.
- EMI/EMC Product design review.
- EMC Performance Requirements Definition.
- Design mitigation.
- Gap Analysis & Risk Mitigation Plans.
- Compliance risk assessments.
- Flow Down Requirements.
DFX & CAM Analysis
- Design for manufacturing/Analysis (DFM) analysis and evaluation
- Design for Test (DFT) analysis as per specific test fixture requirements.
- Verification of inputs files for CAM Compatibility, generating reports on individual board characteristics against manufacturing spec.
- Verification of opens and shorts, Matching of drill data for accuracy.
- Layer Analysis for annular ring, space & trace widths, solder Mask, fiduciary openings & exposed traces.
- Silkscreen removal, scoring, V-cuts, routing, slot, route and retain, test coupons
- Gerber Translation/Reconstruction, Gerber-DFX,DXF editing & conversion
Argus Systems a globally recognized Electronic Hardware Design and electronic manufacturing company Providing hardware system design, Electronics Hardware design,PCB layout design and product design analysis (Signal Integrity,Power Integrity,Thermal,Reliability,EMI,EMC,DFM,DFA,DFT and regulatory compliance) to Its Global Clients in India,USA,UK, and Australia for Automotive,Medical,Aerospace & Defense and Industrial applications. .