Power Integrity is not a new term in high-speed digital design and analysis. Ever increasing count of PCB layout planes, form factor limitation, high IC density, cost constraint are few of many factors which results in complex electronic designs.
Power integrity ( PI ) Analysis is sometimes assumed as a sub discipline of Signal Integrity, but as they are coherently related they have distinctive features of their own which are to be done in different ways. Signal Integrity analysis is based on transmission lines whereas in Power Integrity analysis we are dealing with power distribution through transmission planes.
Power Integrity can identify the potential problems and with appropriate modifications and validations the analysis can be done again, this trial and error approach helps to identify problem on virtual prototypes and saves in turn cost of actual manufacturing and later re-spin of boards.
Depending on the above definition the Power Integrity analysis has different types of simulations which can be listed as:
Each of these phase requires expensive tools and capital equipment expenditures which can be lowered significantly if these can be outsourced to the external custom electronic design team that has the required tools and experience. This will in turn reduce the operational cost of the start-up business and help them to focus on their strategy and lean them to profitability.
Argus Systems is leader in PCB and system-level design and analysis Services offering Power Integrity Analysis, SI analysis, Thermal Analysis, Cross-talk analysis, EMI Analysis, Reliability, availability and maintainability analysis for applications like Defense, Space, Avionics, Networking,Telecom, Industrial, Medical, Semiconductor, Robotics, Computing and Automotive.
EMI and EMC Simulation and Analysis at Product Design phase all electronic products which are intended for commercial, residential, industrial or military use must pass EMC (Electromagnetic compatibility) and electromagnetic interference (EMI) standards tests. They must perform their intended function in the electromagnetic environment and also must not degrade the performance of other devices.
These standards are country specific and are governed by local organizations. The EMI testing on electronic equipment for the United States is handled by the Federal Communications Commission (FCC) and is commonly referred as Part 15 testing. The EMI testing for Canada is presented in the Industry Canada ICES-003 standard. In Japan the EMI testing standard is outlined by VCCI. Majority of worldwide standards are derived from Comite International Special des Perturbations Radio electriques (CISPR) standards or International Electrotechnical Commission (IEC) EMC/EMI/ESD standards.
EMI and EMC Simulation and Analysis at Product Design phase tests are often performed late in the product development cycle, generally at the system level using expensive anechoic chamber. This approach leads to lengthy development cycle and turns out to be very expensive if violations are discovered at this stage. It is recommended to opt for design analysis services if your product is time or mission critical. Many optimizations can be done at PCB design phase and layout can be modified with minimal cost and effort.Using design, analysis and verification techniques early in design cycle is recommended as it helps in eliminating many layout iterations.
Analysis of radiated emission, far and near field emission , EMC emission can be done. SI and crosstalk issues can be resolved at this stage These analyses provide insights that helps in successful regulation compliance testing and thus avoid costly hardware re-spins and reduce time-to-market.
Argus System in USA, UK and India offers various design analysis services including EMI and EMC simulation services and will help you in Identifying EMI/EMC related problems early in the design cycle to ensure success of your new product.