PCB Fabrication

PCB Fabrication

Argus Systems is leading provider of professional high quality multi-layered Rigid, Flexible, Flexi Rigid, Metal Core and PTFE Teflon Printed Circuit Boards (PCB) for Avionics, defense, Medical, Instrumentation and commercial applications. Argus technical expertise enables PCB Fabrication at competitive prices. We specialize in different types of printed circuit boards including multi-layer Rigid PCB, Flexible PCB, rigid flex PCB and metal core PCB.

Our Printed Circuit Boards capabilities supports high frequency PCB, High temperature Boards, Thick PCB, ultra-thin PCB, heavy copper PCB, Metal Core PCB, HDI boards with Blind/Buried Vias, Embedded passives, bonded heat sink, Impedance Control, Depth control drilling, Back drilling, Edge Plated PCB, Bump Pads, cavity with ledge, Via on pad and stacked micro-Via technology. Argus engineering team can work with you to review your design to make sure that printed circuit boards can be manufactured within budget constrained but without any compromise on quality. We excel in providing you with high quality Printed circuit boards to meet your exact requirements.

As an established PCB Supplier with in-depth understanding of the Printed Circuit Board domain including complete product design life cycle, we have the competence to offer you finest quality boards within the specification and quantity that you desire.

PCB Manufacturing

hardware architecture

High Reliability PCB

  • Multilayer up to 60+ layers.
  • Embedded passives.
  • Heavy copper up to 10 oz.
  • Over 50 UL approved laminates.
  • Thickness up to 0.450".
  • Thin core dielectrics.
  • Dimensions up to 30" x 54".
  • Mixed dielectrics.
Component engineering

PCB Thermal Management

  • Passive and active designs.
  • Buried metal core constructions.
  • Externally mounted heatsinks.
  • Epoxy and B-stage films.
  • Thermal & conductive bonding.
  • Aluminium & copper base materials
  • Various surface finishes
  • In-house milling and bonding
pcb Library development


  • Up to 12L "any-layer" stacked uVia Structure
  • 1.6/2.0 mil line / space
  • Wide material & surface finish selections
  • 14 mil, 6L ultra thin structure.
  • 3/7 mil uVia / Pad size.
  • 0.4 mm pitches BGA with 2 traces fanout.
  • Embedded, distributed and discrete passive components.
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RF & Microwave

  • High frequency and bandwidth designs.
  • Planar and screened resistors.
  • Mixed dielectrics (hybrids).
  • Dielectric foam.
  • Conductive paste.
  • Plated cavities.
  • Formed (conformal) PCBs.
  • Optical machining.
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Flex & Rigid-Flex

  • Double sided, multilayer and rigid-flex
  • 30+ layers.
  • Dimensions up to 24" x 48".
  • Acrylic, epoxy and adhesive-less polyimide flex materials.
  • Over 50 rigid material options.
  • Thickness up 0.300".
  • Bikini cut, bookbinder, loose leaf construction
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IC Substrates

  • 2,4,6 Layers (2+2+2 stacked via).
  • BT material.
  • Wire bonding types.
  • Soft/Hard gold.
  • IC Substrate Type:
  • SIP, CSP, BOC & FC package.
  • Fine trace width/space 25/25um.
  • Thin board: 130um(2L), 170um(4L)
  • Flip chip C4 pad.

Our professional team of experts in India, USA and UK are available via phone or email for your consultation on any of PCB fabrication requirements.