Rigid, Flexible & Rigid-Flex PCB Fabrication

HDI PCB, RF & Microwave PCB, High Reliability, IC Substrates, Thermal Management

PCB Manufacturing

Argus Systems is leading PCB Manufacturing company providing professional high quality multi-layered Rigid, Flexible, Flexi Rigid, Metal Core and PTFE Teflon Printed Circuit Boards(PCB) for Avionics, defence, Medical, Instrumentation and commercial applications. Argus technical expertise enables PCB Fabrication at competitive prices. We specialize in different types of printed circuit boards including multi-layer Rigid PCB, Flexible PCB, rigid flex PCB and metal core PCB.

Our Printed Circuit Boards capabilities supports high frequency PCB, High temperature Boards, Thick PCB, ultra-thin PCB, heavy copper PCB, Metal Core PCB, HDI boards with Blind Vias, Buried Vias, Micro Vias, Embedded passives, bonded heat sink, Impedance Control, Depth control drilling, Back drilling, Edge Plated PCB, Bump Pads, cavity with ledge, Via on pad and stacked micro-Via technology. Argus engineering team can work with you to review your PCB design to make sure that pcb manufacturing can be within budget constrained but without any compromise on quality. We excel in providing you with high quality Printed circuit boards to meet your exact requirements.

As an established PCB Fabrication Supplier with in-depth understanding of the Printed Circuit Board domain including complete product design life cycle, we have the competence to offer you finest quality boards within the specification and quantity that you desire.

PCB Fabrication


hardware architecture

High Reliability PCB Manufacturer

  • Multilayer PCB manufacturer of up to 60+ layers.
  • Embedded passives.
  • Heavy copper up to 10 oz.
  • Over 50 UL approved laminates.
  • Thickness up to 0.450".
  • Thin core dielectrics.
  • Dimensions up to 30" x 54".
  • Mixed dielectrics.
Component engineering

PCB Thermal Management

  • Passive and active designs.
  • Buried metal core PCB (Aluminum, Copper, Copper Invar Copper).
  • Externally mounted heat sinks.
  • Epoxy and B-stage films.
  • Thermal & conductive bonding.
  • Aluminium & copper base materials
  • Various surface finishes
  • In-house milling and bonding
pcb Manufacturer

HDI PCB

  • Up to 12L "any-layer" stacked uVia Structure
  • 1.6/2.0 mil line / space
  • Wide material & surface finish selections
  • 14 mil, 6L ultra thin structure.
  • 3/7 mil uVia / Pad size.
  • 0.4 mm pitches BGA with 2 traces fan out.
  • Embedded, distributed and discrete passive components.
PCB Manufacturing

RF & Microwave

  • High frequency and bandwidth designs.
  • Planar and screened resistors.
  • Mixed dielectrics (hybrids).
  • Dielectric foam.
  • Conductive paste.
  • Plated cavities.
  • Formed (conformal) PCBs.
  • Optical machining.
pcb layout design in india

Flex & Rigid-Flex PCB Manufacturer

  • Double sided, multilayer flex and rigid-flex
  • 30+ layers.
  • Dimensions up to 24" x 48".
  • Acrylic, epoxy and adhesive-less polyimide flex materials.
  • Over 50 rigid material options.
  • Thickness up 0.300".
  • Bikini cut, bookbinder, loose leaf construction
PCB Fabrication

IC Substrates

  • 2,4,6 Layers (2+2+2 stacked via).
  • BT material.
  • Wire bonding types.
  • ENEPIG
  • Soft/Hard gold.
  • IC Substrate Type:
  • SIP, CSP, BOC & FC package.
  • Fine trace width/space 25/25um.
  • Thin board: 130um(2L), 170um(4L)
  • Flip chip C4 pad.

Argus Systems a globally recognized PCB Manufacturer supports Fabrication of Printed Circuit Boards (PCB) for Its Global Clients in India, USA, UK and Australia.