Argus PCB design business in relevance to telecom product designs
Thermal Management & Reliability
The Key difference between the telecom industry and the consumer electronics industry is telecom’s need for very high reliability and availability. Electronic Systems reliability is very important to the telecom and data communication service providers in current highly price competitive business environment. Argus PCB Design business has been refined and tuned as per the relevance of telecom product design.
Operating costs for maintenance and replacement of telecom products are higher (especially wireless base stations installed in remote and unmanned locations), unless the equipment is highly dependable throughout its lifetime.
Telecom product availability and reliability primarily depends upon architectural redundancy, software robustness and manufacturing quality, however the reliability of the product on the printed circuit boards is majorly affected by the temperature of the equipment.
Increasing computing requirements and higher network traffic coupled with 24/7 availability mandates are contributing to increased power densities in PCB and enclosures.
This makes sophisticated system-level thermal design and management a vital part of designing telecom equipment’s. Argus design team has to optimize the thermal design equipment by modeling and analyzing printed circuit board (PCB) temperatures using design analysis tools.
Argus has introduced System Reliability, availability and maintainability analysis as part of its design analysis flow specific to telecom products.
The telecom products are pushing technology envelops with ever increasing features sets as it continuously seeks to reduce the form factor and weight of product. Due to complexity of telecom Printed Circuit Boards Argus had to upgrade to high performance PCB Design & circuit simulation tools, introduce additional design analysis & manufacturing verification tools and upgrade existing design methodologies to match up with advanced PCB design technologies.
- Mixed digital/analog/RF Designs with embedded Passives
- High Layer count & High density Designs
- Impedance controlled Designs
- High speed interconnects , Multiple High pin count Ultra Fine pitch Devices
- Designs with Micro Vias, Blind, Buried Via
Product development schedule speedups with concurrent design practices
In telecom field where quicker deployments of new product are a critical driver, Argus is utilizing concurrent design techniques during multiple stages of the Product design process.
Argus earlier approach of concurrent design by establishing an around-the-clock design schedule had significant helps improved development time as increasing design complexities required the constant presence of product engineering team.
In addition to it Adapting to team design methodologies allowed multiple designers to work simultaneously on the same product design phase of PCB layout and simulation.
Change in scenarios for Argus products and solutions over the past couple of years
In past couple of years we have seen a shift in demand from wired networking products to wireless networking products. Argus revamped its technology and solutions roadmap a year ago foreseeing these technology trends.
Earlier majority of argus development plan was focused on technologies such as CPE/Gateway with GigE, XDSL, VoIP, IP-STB), FFTx Access systems and Broadband Wireless systems which were feature rich, High cost and generic. Due to emergence of IoT now we are seeing more demands for better/low priced, limited & specific features set Internet enabled Devices with varied applications compared.
Customer has to expect same cost of acquisition as previous Gen Product with more Features. This has led to cost pressure in keeping the product BOM lower considering stringent quality and high reliability requirements of telecom systems.
In spite of having a competitive priced and featured product Argus has lost out to some of the high volume product segments unable to compete with low cost imported products.
Challenges and way forward for product engineering companies developing telecom product
In mobile telecom interconnect size and form factors are reducing rapidly, while designs are incorporating more complex higher pin count components. At the same time, PCB are getting big, with increased layer count counts adding to the cost.
Unavailability of locally manufactured electronic components, relatively higher cost of import duty on BOM items and domestic electronic manufacturing not able to keep up with the advance manufacturing requirements of telecom systems is some of the reason Indian products not able to compete with cheap imports.
Government’s ‘Make in India’ initiative for boosting local manufacturing and setting up of an Electronic Development Fund aimed to facilitate development of innovative products might be able to address some of these issues and make Indian made electronic products and telecoms systems competitive at global scale.
There should be a mechanism in which Telecom technology arm of the Govt interacts with the industry to create product development road-map and Requirement specifications which can be taken up by product engineering companies. Telecom product Design in India is at its nascent stage but over the period of time we hope things will change for better.
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is India’s leading company in providing electronic product design services
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