Argus PCB design business in relevance to telecom product designs
Thermal Management & Reliability
The Key difference between the telecom industry and the consumer electronics industry is telecom’s need for very high reliability and availability. Electronic Systems reliability is very important to the telecom and data communication service providers in current highly price competitive business environment. Argus PCB Design business has been refined and tuned as per the relevance of telecom product design.
Operating costs for maintenance and replacement of telecom products are higher (especially wireless base stations installed in remote and unmanned locations), unless the equipment is highly dependable throughout its lifetime.
Telecom product availability and reliability primarily depends upon architectural redundancy, software robustness and manufacturing quality, however the reliability of the product on the printed circuit boards is majorly affected by the temperature of the equipment.
Increasing computing requirements and higher network traffic coupled with 24/7 availability mandates are contributing to increased power densities in PCB and enclosures.
This makes sophisticated system-level thermal design and management a vital part of designing telecom equipment’s. Argus design team has to optimize the thermal design equipment by modeling and analyzing printed circuit board (PCB) temperatures using design analysis tools.
Argus has introduced System Reliability, availability and maintainability analysis as part of its design analysis flow specific to telecom products.
Design complexities
The telecom products are pushing technology envelops with ever increasing features sets as it continuously seeks to reduce the form factor and weight of product. Due to complexity of telecom Printed Circuit Boards Argus had to upgrade to high performance PCB Design & circuit simulation tools, introduce additional design analysis & manufacturing verification tools and upgrade existing design methodologies to match up with advanced PCB design technologies.
- Mixed digital/analog/RF Designs with embedded Passives
- High Layer count & High density Designs
- Impedance controlled Designs
- High speed interconnects , Multiple High pin count Ultra Fine pitch Devices
- Designs with Micro Vias, Blind, Buried Via
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